TDA3MVRBFABFRQ1 Texas Instruments System On Chip (SoC)

Mfr: Texas Instruments
Series: -
Package: Tape & Reel (TR)
Product Status: Active
Architecture: DSP, MPU
Core Processor: ARM® Cortex®-M4, C66x
Flash Size: -
RAM Size: 512kB
Peripherals: DMA, PWM, WDT
Connectivity: CAN, MMC/SD/SDIO, McASP, I²C, SPI, UART, USB
Speed: 212.8MHz, 745MHz
Primary Attributes: -
Operating Temperature: -40°C~125°C(TJ)
Package / Case: 367-BFBGA, FCBGA
Supplier Device Package: 367-FCBGA (15x15)
Number of I/O: 126