Mfr: Renesas Electronics America Inc
Series: H8® H8S/2100
Package: Tray
Product Status: Not For New Designs
Core Processor: H8S/2600
Core Size: 16-Bit
Speed: 20MHz
Connectivity: FIFO, I²C, LPC, SCI, SmartCard
Peripherals: POR, PWM, WDT
Number of I/O: 128
Program Memory Size: 160KB (160K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -20°C~75°C(TA)
Mounting Type: Surface Mount
Package / Case: 176-LFBGA
Supplier Device Package: 176-LFBGA (13x13)
Base Product Number: DF2117
